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Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 Sampling

AI · Hardware · 2026-11-03 16:36

高通宣布完成高带宽计算（HBC）内存架构初步验证，该堆叠技术将用于Dragonfly AI加速器，预计明年开始采样。

Source: www.servethehome.com

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